The International Conference for High Performance Computing, Networking, Storage, and Analysis
The International Conference for High Performance Computing, Networking, Storage, and Analysis
Moderator: Dan Olds (Intersect360)
Panelists: Phil Pokorny (Penguin Solutions), JD Enright (TMGcore), Cameron Cross (Shell), Daniel Pope (Submer), Curt Wallace (Green Revolution Cooling)
Abstract: As the world increasingly relies on a new era of high-wattage CPU and GPU platforms to deliver HPC and AI breakthroughs, deploying and cooling these systems within traditional data centers presents a problem. This panel will discuss the need to create more sustainable deployment environments and how immersion cooling is a critical piece to this puzzle.
Join expert panelists in a discussion about the following three considerations: 1) Cost, 2) Available Options, and 3) Service/Support/Warranty Implications. The panel will discuss why out with the old (cooling with fans) and in with the immersive (immersing HPC and AI servers into high-tech non-conductive fluid) is a sustainable option for the future of modern data centers. Most people can agree on one thing – driving rack density and cooling of high-wattage processors presents a new set of challenges. The good news? We have options! Join our SC23 panel to learn more.